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장비소개 / 표면분석

분석목적 및 측정량 장비
구성성분원소 (Element composition) XPS, AES, TOF-SIMS, D-SIMS, XRF, MEIS, EA
원소깊이분포 (Depth profile) XPS, AES, TOF-SIMS, D-SIMS, MEIS, XRD(HR1)
2차원, 3차원 영상화 (2D, 3D imaging) AFM, TOF-SIMS, D-SIMS, AES, XPS, XRF, XRD(D1)
화학결합상태 (Chemical environment) XPS, AES, NEXAFS
가전자대 및 전도대 상태밀도
(Core, valence, conduction band density of state)
XPS, UPS, NEXAFS, EXAFS
산화상태 (Oxidation state) XPS, NEXAFS, EXAFS
표면 거칠기, 위상, 전기적 특성
(Roughness, phase, electrical properties)
AFM